Sino-Dutch Summer School 2017

On the behalf of the steering committee and the organizing committee, we would like to welcome you to the sixth edition of the Sino-Dutch International IC Technology Exchange and High Talent Summer School. The objective of this Summer School is to strengthen the collaboration between China and the Netherlands in the field of micro- and nano-electronics.  The school provide a unique opportunity for highly talented Ph.D. students (both from the Netherlands and China) to learn about semiconductor technologies, start-up and entrepreneurship, and soft skills and their added value, from well recognised experts from academia and industry (both from the Netherlands and China). In addition, the school invites some delegates from universities and corporations and focuses on intensive interaction between all the participants, not only to develop and enhance students soft skills for a successful career in a global and technology demanding world, but also to promote the development of the IC Industry and creates a network for high level cooperation in a field, which is basic for almost all future innovations.  Hence, the event sets another step forward in creating a link between Dutch and Chinese talented students, academia and industries. The 2017 edition of the school will hosted by Tsinghua university in Beijing. The theme is: “Integrated Circuits for Internet-of-Things”.

This highly recognised summer school continues its well-established format by providing an exceptional high quality program covering not only semiconductor technologies, but also start-ups and entrepreneurship as well as soft skills to prepare students for the students for a successful career in a global and technology demanding world. The program consists of five components:

  • Keynotes & industrial talks.
  • Conventional Technologies: this  component covers different common aspects of the Integrated Circuits (ICs) and semiconductor technology (including device technology, manufacturing, packaging, test, reliability, …) from the basics up to state-of-the art and future challenges.
  • Emerging Technologies: This component covers some emerging technologies such as power electronics, IoT, FinFET, Resistive memories, monolithic stacking, etc.
  • A theme topic: this component covers a specific theme. The theme of this year will be “ICs for Internet of Things (IoT)”.
  • Start-up & entrepreneurship:  this component covers entrepreneurship and start-ups. This is in order to make students familiar with the idea of setting up a company and learn from the experience of others. By doing this, we aim at inspiring top talented PhD students to consider the creation of their own start-ups and have an economic impact in the future.
  • Soft skills: this component covers soft skills training (e.g., intercultural communication, leadership in science, science and diversity, framing, presenting, etc.) and usually given by Motiv training company. These skills are very critical for today’s and future especially when considering the current globalized and horizontal IC and semiconductor business model.

At this point, we would like to thank everyone who enabled the organisation of this school, including the sponsors an supports,  the organising committee, the steering committee, the delegates,  the speakers and the students. A successful summer school would not be possible without individual contributions of all of you.

We fully believe that with specially designed, high level and dedicated program, and by focusing on the development not only of top talents and future technology leaders, but also of IC Industry, this summer school will be successful, enjoyable and unforgettable. It establishes a high level network for your future career in an extremely challenging field.


Group Picture 2017


Tsinghua University